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341746

Sigma-Aldrich

Copper(II) acetate hydrate

98%

동의어(들):

Cupric acetate hydrate

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About This Item

Linear Formula:
Cu(CO2CH3)2 · xH2O
CAS Number:
66923-66-8
Molecular Weight:
181.63 (anhydrous basis)
EC Number:
205-553-3
MDL number:
MFCD00149570
UNSPSC 코드:
12352103
PubChem Substance ID:
24860988
NACRES:
NA.23

vapor density

6.9 (vs air)

분석

98%

형태

crystals

구성

Degree of hydration, ~1

반응 적합성

core: copper

SMILES string

O.CC(=O)O[Cu]OC(C)=O

InChI

1S/2C2H4O2.Cu.H2O/c2*1-2(3)4;;/h2*1H3,(H,3,4);;1H2/q;;+2;/p-2

InChI key

NWFNSTOSIVLCJA-UHFFFAOYSA-L

픽토그램

Exclamation markEnvironment
GHS07,GHS09

신호어

Warning

유해 및 위험 성명서

H302,H315,H319,H335,H400

Hazard Classifications

Acute Tox. 4 Oral - Aquatic Acute 1 - Eye Irrit. 2 - Skin Irrit. 2 - STOT SE 3

표적 기관

Respiratory system

Storage Class Code

11 - Combustible Solids

WGK

WGK 3

Flash Point (°F)

Not applicable

Flash Point (°C)

Not applicable

개인 보호 장비

dust mask type N95 (US), Eyeshields, Gloves

시험 성적서(COA)

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Group 11 Thin Films by Atomic Layer Deposition

Copper metal deposition processes are an essential tool for depositing interconnects used in microelectronic applications, giving group 11 (coinage metals: Copper, Silver, and Gold) an important place in atomic layer deposition (ALD) process development.

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