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21679-31-2
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Deposition and Semiconductor Materials
Melting point:210-213 °C
(lit.)
21679-46-9 494534
Copper bis(2,2,6,6-
tetramethyl-3,5-
heptanedionate)
Cu(TMHD)2 99% Solid Melting point: 198 °C
(lit.)
14040-05-2 345083
Copper(II)
trifluoroacetylacetonate