추천 제품
Quality Level
분석
97%
양식
powder and chunks
반응 적합성
core: copper
reagent type: catalyst
mp
250 °C (dec.) (lit.)
SMILES string
CC(=O)O[Cu]
InChI
1S/C2H4O2.Cu/c1-2(3)4;/h1H3,(H,3,4);/q;+1/p-1
InChI key
RFKZUAOAYVHBOY-UHFFFAOYSA-M
애플리케이션
Copper acetate(CuOAc) was used as a starting material for the preparation of copper nanoparticles and CuAlO2 p-type nanostructured semiconductors.
Storage Class Code
11 - Combustible Solids
WGK
WGK 3
Flash Point (°F)
Not applicable
Flash Point (°C)
Not applicable
개인 보호 장비
dust mask type N95 (US), Eyeshields, Gloves
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시험 성적서(COA)
Lot/Batch Number
이미 열람한 고객
Synthesis of delafossite CuAlO 2 p-type semiconductor with a nanoparticle-based Cu (I) acetate-loaded boehmite precursor
Thu TV, et al.
Mat. Res. Bul., 46.11, 1819-1827 (2011)
Room?Temperature Formation of Hollow Cu2O Nanoparticles.
Hung LI, et al.
Advanced Materials, 22.17, 1910-1914 (2010)
Jan Lorkowski et al.
Chemistry (Weinheim an der Bergstrasse, Germany), 25(48), 11365-11374 (2019-07-06)
Cyclic (amino)(aryl)carbenes (cAArCs) based on the isoindoline core were successfully generated in situ by α-elimination of 3-alkoxyisoindolines at high temperatures or by deprotonation of isoindol-2-ium chlorides with sodium or copper(I) acetates at low temperatures. 3-Alkoxy-isoindolines 2 a,b-OR (R=Me, Et, iPr) have
You Zhai et al.
Chemphyschem : a European journal of chemical physics and physical chemistry, 17(5), 741-751 (2015-11-04)
Cu2 S/ZnS heterostructured nanorods (HNRs) with uncommon morphologies are achieved through single-pot and multi-batch synthetic strategies. In both cases, Cu2 S NRs form first, which then undergo partial cation exchange and solution-liquid-solid (SLS)-like growth catalyzed by the remaining Cu2 S
Tianzhi Luo et al.
Biomacromolecules, 18(8), 2539-2551 (2017-07-19)
Over the past few decades, (poly)peptide block copolymers have been widely employed in generating well-defined nanostructures as vehicles for targeted drug delivery applications. We previously reported the assembly of thermoresponsive nanoscale vesicles from an elastin-b-collagen-like peptide (ELP-CLP). The vesicles were
문서
Copper metal deposition processes are an essential tool for depositing interconnects used in microelectronic applications, giving group 11 (coinage metals: Copper, Silver, and Gold) an important place in atomic layer deposition (ALD) process development.
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