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767484

Sigma-Aldrich

Nickel

sputtering target, diam. × thickness 2.00 in. × 0.25 in., 99.95% trace metals basis

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About This Item

Empirical Formula (Hill Notation):
Ni
CAS Number:
7440-02-0
Molecular Weight:
58.69
EC Number:
231-111-4
MDL number:
MFCD00011137
UNSPSC Code:
12352103
PubChem Substance ID:
329767317
NACRES:
NA.23

Quality Level

100

assay

99.95% trace metals basis

form

solid

reaction suitability

core: nickel

resistivity

6.97 μΩ-cm, 20°C

diam. × thickness

2.00 in. × 0.25 in.

bp

2732 °C (lit.)

mp

1453 °C (lit.)

density

8.9 g/mL at 25 °C (lit.)

SMILES string

[Ni]

InChI

1S/Ni

Inchi Key

PXHVJJICTQNCMI-UHFFFAOYSA-N

Related Categories

Application

Sputtering is a process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic particles. The extreme miniaturization of components in the semiconductor and electronics industry requires high purity sputtering targets for thin film deposition.

pictograms

Health hazardExclamation mark
GHS08,GHS07

signalword

Danger

Hazard Classifications

Carc. 2 - Skin Sens. 1 - STOT RE 1

Storage Class

6.1D - Non-combustible acute toxic Cat.3 / toxic hazardous materials or hazardous materials causing chronic effects

wgk_germany

WGK 2

flash_point_f

Not applicable

flash_point_c

Not applicable

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Certificates of Analysis (COA)

Lot/Batch Number
MKCT6533
MKCM2517
MKBN4024V

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Including students' perceptions in the educational process is considered a key component in monitoring the quality of academic programs. This study aimed to evaluate the concept of one's learning experience in endodontic teaching from the perspective of a group of
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Cognizance of the mechanical properties of nickel-titanium archwires is necessary for the management of orthodontic therapy with fixed appliances. Acting on the periodontium with forces that are too heavy may lead to such complications as: pain, tooth root resorption and
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