추천 제품
형태
powder or chunks
solid
Quality Level
구성
Cu, 17.0-19.0% EDTA titration
반응 적합성
core: copper
reagent type: catalyst
mp
252 °C (dec.) (lit.)
SMILES string
CCCCC(CC)C(=O)O[Cu]OC(=O)C(CC)CCCC
InChI
1S/2C8H16O2.Cu/c2*1-3-5-6-7(4-2)8(9)10;/h2*7H,3-6H2,1-2H3,(H,9,10);/q;;+2/p-2
InChI key
SEKCXMNFUDONGJ-UHFFFAOYSA-L
애플리케이션
- Copper catalyzed Heck-like cyclizations of oxime esters: Discusses the catalytic role of Copper(II) 2-ethylhexanoate in cyclization reactions and its potential reduction or disproportionation under certain conditions (Faulkner et al., 2014).
- A Copper‐Mediated Oxidative Coupling Route to 3H‐ and 1H‐Indoles: Utilizes Copper(II) 2-ethylhexanoate for synthesizing indoles, showcasing its effectiveness in facilitating novel chemical transformations (Drouhin & Taylor, 2015).
- Cu (II) carboxylate arene C─H functionalization: Details how Copper(II) 2-ethylhexanoate is used in nonradical pathways for functionalizing aromatic compounds, significantly advancing synthetic chemistry methodologies (Kong et al., 2022).
- Decarboxylative olefination of activated aliphatic acids: Describes the catalytic capabilities of Copper(II) 2-ethylhexanoate in decarboxylative olefination processes, enhancing the efficiency and scope of organic syntheses (Tlahuext-Aca et al., 2018).
신호어
Danger
유해 및 위험 성명서
Hazard Classifications
Repr. 1B
Storage Class Code
6.1C - Combustible acute toxic Cat.3 / toxic compounds or compounds which causing chronic effects
WGK
WGK 3
Flash Point (°F)
Not applicable
Flash Point (°C)
Not applicable
개인 보호 장비
dust mask type N95 (US), Eyeshields, Gloves
이미 열람한 고객
문서
Copper metal deposition processes are an essential tool for depositing interconnects used in microelectronic applications, giving group 11 (coinage metals: Copper, Silver, and Gold) an important place in atomic layer deposition (ALD) process development.
자사의 과학자팀은 생명 과학, 재료 과학, 화학 합성, 크로마토그래피, 분석 및 기타 많은 영역을 포함한 모든 과학 분야에 경험이 있습니다..
고객지원팀으로 연락바랍니다.