667498

Tungsten etchant

• 동의어(들): Tungsten etch
• MDL number: MFCD08705365
• UNSPSC 코드: 12352300
• NACRES: NA.23

속성

• Quality Level: 100

설명

일반 설명

Tungsten etchant is a mixture of potassium hydroxide and potassium ferricyanide based solution that facilitates the removal of tungsten and other materials like aluminium by dipping the substrate into the etching solution.

애플리케이션

Selective etchants for tungsten thin-film metallizations used in semiconductor and microelectronics technology. Etchants are buffered, mildly alkaline ferricyanide-based formulations providing high resolution patterns with minimal undercutting and photoresist compatibility. Etchant is ready to use (no dilution required). Controlled, uniform etching is achieved by immersion or spray etch technique. Etch Capacity (rate declines at ∼70%) of 64 g/gallon. Recommended Operating Temperatures: 20-80 °C (30-40 °C most common).

제조 메모

1. Select your etching method according to the table belowEtch Rate (Immersion) Etch Rate (Spray)

• 20°C = 30 Å/second
• 30°C = 140 Å/second 20°C = 80 Å/second
• 60°C = 250 Å/second

2. Rinse with DI water

안전성 정보

• 픽토그램: GHS05
• 신호어: Danger
• 유해 및 위험 성명서: H290,H314,H412
• 예방조치 성명서: P234 - P273 - P280 - P303 + P361 + P353 - P304 + P340 + P310 - P305 + P351 + P338
• Hazard Classifications: Aquatic Chronic 3 - Eye Dam. 1 - Met. Corr. 1 - Skin Corr. 1A
• 보충제 위험성: EUH032
• Storage Class Code: 8B - Non-combustible corrosive hazardous materials
• WGK: WGK 2
• Flash Point (°F): Not applicable
• Flash Point (°C): Not applicable
• 개인 보호 장비: Faceshields, Gloves, Goggles, type ABEK (EN14387) respirator filter