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Merck
모든 사진(1)

문서

D61504

Sigma-Aldrich

Dichlorodiphenylsilane

97%

동의어(들):

Diphenyldichlorosilane

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About This Item

Linear Formula:
(C6H5)2SiCl2
CAS Number:
Molecular Weight:
253.20
Beilstein:
609882
EC Number:
MDL number:
UNSPSC 코드:
12352103
PubChem Substance ID:
NACRES:
NA.23

vapor density

>1 (vs air)

vapor pressure

2 mmHg ( 125 °C)

분석

97%

형태

liquid

refractive index

n20/D 1.578 (lit.)

bp

305 °C (lit.)

density

1.204 g/mL at 25 °C (lit.)

SMILES string

Cl[Si](Cl)(c1ccccc1)c2ccccc2

InChI

1S/C12H10Cl2Si/c13-15(14,11-7-3-1-4-8-11)12-9-5-2-6-10-12/h1-10H

InChI key

OSXYHAQZDCICNX-UHFFFAOYSA-N

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일반 설명

Dichlorodiphenylsilane is a silane based surface modifier, and a precursor which can be used in the synthesis of silica based materials. It is used to modify the surface by providing toughness, durability and resistance to shock.

애플리케이션

Dichlorodiphenylsilane can be used in the synthesis of a host material for the fabrication of blue phosphorescent organic light emitting diodes (OLEDs).
The addition reaction of dichlorodiphenylsilane with diglycidyl ether of bisphenol-S yields poly(silyl ether) with pendant chloromethyl groups. {40} The coupling reaction between dichloromethylsilane and dichlorodiphenylsilane can form diorganosilane-hydrosilane copolymers at -75oC. Heating the compound with tetrabutoxydianilinocyclophosphazene at temperatures between 100oC-160oC may yield cyclophosphazene oligomers.{42}

픽토그램

Skull and crossbonesCorrosion

신호어

Danger

유해 및 위험 성명서

Hazard Classifications

Acute Tox. 2 Dermal - Skin Corr. 1B

Storage Class Code

6.1A - Combustible acute toxic Cat. 1 and 2 / very toxic hazardous materials

WGK

WGK 1

Flash Point (°F)

287.6 °F - closed cup

Flash Point (°C)

142 °C - closed cup

개인 보호 장비

Faceshields, Gloves, Goggles, type ABEK (EN14387) respirator filter


시험 성적서(COA)

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문서 라이브러리 방문

이미 열람한 고객

Synthesis of poly (silyl ether) by the addition reaction of bisphenol-S diglycidyl ether and dichlorodiphenylsilane.
Liaw DJ
Polymer, 38(20), 5217-5219 (1997)
Diphenylsilanes containing electronically isolated carbazolyl fragments as host materials for light emitting diodes
Zostautiene R, et al.
Synthetic Metals, 161(1-2), 92-95 (2011)
Preparation and Properties of Polysiloxane Modified Epoxy Encapsulating Material
Advanced Materials Research, 1021(6), 3-6 (2014)
Si-H functional polysilanes via a homogeneous reductive coupling reaction.
Sacarescu G, et al.
Macromolecular Rapid Communications, 22(6), 405-408 (2001)
Branched diphenylsilane derivatives containing electronically isolated indolyl moieties as host materials for blue organic light emitting diodes
Zostautiene R, et al.
Dyes and Pigments, 91(2), 177-181 (2011)

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