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651818

Sigma-Aldrich

Gold etchant, standard

Synonym(s):

Antistrumin, Potassium monoiodide

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About This Item

CAS Number:
7681-11-0
MDL number:
MFCD07370792
UNSPSC Code:
12352302
NACRES:
NA.23

composition

volatiles, 50-80%

bp

100 °C (lit.)
100 °C/1 atm

solubility

H2O: miscible

density

1.2924 g/mL at 25 °C (lit.)

InChI

1S/HI.K/h1H;/q;+1/p-1

InChI key

NLKNQRATVPKPDG-UHFFFAOYSA-M

Related Categories

General description

Etching readily controlled with minimum undercutting. Room temperature operated. Cyanide-free for standard applications. Etch rate of 28 angstrom/sec @ 25 °C.
Gold etchant is a combination of potassium iodide and iodine as complexing agents synthesized by electrochemically oxidizing gold.

application

Gold etchant is a selective general-purpose etchant for gold, compatible with negative and positive photoresists. It is used to etch out gold (Au) electrodes prior to scanning electron microscopy (SEM) imaging for morphological study and metal layer for the preparation of nanoelectrodes array. Gold etchant can also be used in metal assisted chemical etching (MACE) for the fabrication of p-n junction silicon nanopillar based solar cells.

pictograms

Health hazard
GHS08

signalword

Danger

hcodes

H372

Hazard Classifications

STOT RE 1 Oral

target_organs

Thyroid

Storage Class

6.1D - Non-combustible acute toxic Cat.3 / toxic hazardous materials or hazardous materials causing chronic effects

wgk_germany

WGK 3

flash_point_f

Not applicable

flash_point_c

Not applicable

ppe

Eyeshields, Faceshields, Gloves, multi-purpose combination respirator cartridge (US)

Certificates of Analysis (COA)

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High performance nanopillars array silicon solar cells.
Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 117(10), 1-5 (2013)
Cyanide-and thiourea-free electrochemical etching of gold for microelectronics applications.
Hu Z and Ritzdorf T
Journal of the Electrochemical Society, 154(10), D543-D549 (2007)
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Protocols

Negative Photoresist Procedure

Photoresist kit offers pre-weighed chemical components for lithographic processes, with separate etchants for various substrate choices.

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