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Tungsten etchant

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Synonym(s):
Tungsten etch
MDL number:
NACRES:
NA.23

Quality Level

General description

Tungsten etchant is a mixture of potassium hydroxide and potassium ferricyanide based solution that facilitates the removal of tungsten and other materials like aluminium by dipping the substrate into the etching solution.

Application

Selective etchants for tungsten thin-film metallizations used in semiconductor and microelectronics technology. Etchants are buffered, mildly alkaline ferricyanide-based formulations providing high resolution patterns with minimal undercutting and photoresist compatibility. Etchant is ready to use (no dilution required). Controlled, uniform etching is achieved by immersion or spray etch technique. Etch Capacity (rate declines at ∼70%) of 64 g/gallon. Recommended Operating Temperatures: 20-80 °C (30-40 °C most common).

Preparation Note

1. Select your etching method according to the table belowEtch Rate (Immersion) Etch Rate (Spray)
  • 20°C = 30 Å/second
  • 30°C = 140 Å/second 20°C = 80 Å/second
  • 60°C = 250 Å/second

2. Rinse with DI water

pictograms

Corrosion

signalword

Danger

Hazard Classifications

Aquatic Chronic 3 - Eye Dam. 1 - Met. Corr. 1 - Skin Corr. 1A

supp_hazards

Storage Class

8B - Non-combustible, corrosive hazardous materials

wgk_germany

WGK 2

flash_point_f

Not applicable

flash_point_c

Not applicable

ppe

Faceshields, Gloves, Goggles, type ABEK (EN14387) respirator filter


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Pattern processing results and characteristics for SCALPEL masks.
Novembre AE, et al.
Microelectronic Engineering, 46(1-4), 271-274 (1999)
Electrostatically actuated copper-blade microrelays.
Lee H, et al.
Sensors and actuators A, Physical, 100(1), 105-113 (2002)
Microstructure Evolution of W-Cu Alloy Wire.
Shao F, et al.
Materials Sciences and Applications, 3(03), 157-157 (2012)

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