추천 제품
Quality Level
분석
≥99.99% trace metals basis
양식
crystalline powder
powder, crystals or chunks
반응 적합성
core: silver
mp
257-260 °C (dec.) (lit.)
SMILES string
FC(F)(F)C(=O)O[Ag]
InChI
1S/C2HF3O2.Ag/c3-2(4,5)1(6)7;/h(H,6,7);/q;+1/p-1
InChI key
KZJPVUDYAMEDRM-UHFFFAOYSA-M
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일반 설명
애플리케이션
- As a precursor to synthesize silver nanoparticles.
- As a starting material to fabricate conducting silver networks with high transmittance and low resistance via a polymer-assisted electrospinning technique.
- As a reagent to prepare polynuclear luminescent complexes.
- As a bifunctional reagent for oxidative carbonylative [4 + 1] annulation of aromatic acid.
신호어
Danger
유해 및 위험 성명서
Hazard Classifications
Acute Tox. 2 Oral - Aquatic Acute 1 - Aquatic Chronic 1
Storage Class Code
6.1A - Combustible acute toxic Cat. 1 and 2 / very toxic hazardous materials
WGK
WGK 3
Flash Point (°F)
Not applicable
Flash Point (°C)
Not applicable
개인 보호 장비
dust mask type N95 (US), Eyeshields, Gloves
이미 열람한 고객
문서
Copper metal deposition processes are an essential tool for depositing interconnects used in microelectronic applications, giving group 11 (coinage metals: Copper, Silver, and Gold) an important place in atomic layer deposition (ALD) process development.
자사의 과학자팀은 생명 과학, 재료 과학, 화학 합성, 크로마토그래피, 분석 및 기타 많은 영역을 포함한 모든 과학 분야에 경험이 있습니다..
고객지원팀으로 연락바랍니다.